The rapid growth of AI is changing the power and cooling requirements of the data center, with higher-density compute creating new challenges for both existing facilities and new deployments.

Recorded as part of Data Center Dynamics’ AI Week 2026, the conversation looks beyond simply delivering more power, examining how power distribution, cooling, and infrastructure planning can evolve together to support higher rack densities.

The discussion explores emerging approaches, including higher-voltage DC architectures, power sidecars, and liquid cooling, as well as the practical challenge of adapting existing data centers to infrastructure requirements that will continue to evolve.

Watch the on-demand broadcast to explore the infrastructure decisions that can help data centers accommodate AI today while preparing for greater density and demand in the future.

 

What You'll Learn:

• What rising AI rack densities mean for data center power and cooling infrastructure
• How power architectures are evolving beyond current OCP designs, with power sidecars and higher-voltage DC distribution supporting increasing rack power requirements
• Why rising power densities are creating new cooling requirements beyond the processors, including for power sidecars and busbars
• How two-phase direct-to-chip cooling could support higher chip densities with lower coolant flow rates
• Key considerations when adapting existing facilities for emerging AI power and cooling architectures